Automatic Solar Cell Fiber Laser Scribing Machine
The Automatic Solar Cell Fiber Laser Scribing Machine is a core photovoltaic production equipment that utilizes a high-precision fiber laser source to perform fully automatic, ultra-precise, high-speed, and nearly non-destructive cutting (scribing) on silicon-based solar cells. It is designed to achieve cell segmentation or specific shape processing.
Product Features
High-Precision Fiber Laser: Utilizes a high-precision fiber laser to perform automated scribing/cutting operations on solar cells (primarily silicon-based), efficiently dividing whole cells into the required dimensions (such as half-cells).
Non-Contact Processing: Employs non-contact fiber laser processing, characterized by high precision, fast speed, minimal thermal damage (small Heat Affected Zone), and excellent chippings control. This significantly reduces cell damage and improves product yield.
Fine Processing Effect: Produces ultra-narrow, uniform kerfs with minimal chipping, maximizing the mechanical strength and electrical performance of the cell. This meets the requirements for subsequent high-precision processes like string soldering and is a key equipment for producing high-efficiency advanced cell components such as half-cut and shingled modules.
Enhanced Processing Efficiency: Significantly improves the processing efficiency and automation level of solar cell module production lines. It is a core production equipment in photovoltaic manufacturing for enhancing cell utilization and module power output.
Technical Parameters
Model Specification: YHC-30
Laser Type: 1064nm Fiber Laser
Beam Quality (M²): 1.3
Worktable Travel: 800×300mm
Max. Scribing Speed: 600mm/s
Scribing Precision: ≤0.02mm
Auto Positioning Accuracy: ≤±0.05mm
Cooling System: Air Cooling
Processing Range: 230×230mm
Compressed Air Requirement: 0.5~0.8MPa
Power Supply: 220V/50HZ
Equipment Dimensions: 2900×930×1740mm
Product Applications
Core Process in PV Cell Manufacturing: This equipment is a key device in crystalline silicon solar cell (monocrystalline/polycrystalline) production lines. It is specifically designed to precisely cut complete square or quasi-square wafers (cell precursors) into smaller required cell units (typically half-cells or smaller dimensions). This is a fundamental step in manufacturing high-efficiency solar cell modules.
High-Efficiency Cell Processing (Half-Cut, Multi-Segmentation Technology): Widely used in producing mainstream half-cut cells and future third-cut or multi-cut cells. Precise laser scribing effectively reduces cell current, minimizes resistive losses and hot spot risk, thereby significantly boosting module power output and reliability.
Wafer Processing & Module Packaging Stages: Besides cutting cell precursors in cell manufacturing, some equipment is also applied in edge treatment/scribing after wafer cutting: Precision cutting or edge trimming of initial silicon ingot-cut wafers. Cell scribing/cutting before module encapsulation: Scribing purchased standard full cells before string soldering to meet the needs of specific module designs (e.g., half-cut modules).
N-Type Cell Technology (TOPCon, HJT, IBC, etc.) & Thinner Wafer Application: Particularly suitable for processing more efficient, thinner, and more fragile N-type cells (like TOPCon, HJT) and the industry's trend towards thinner wafers (e.g.,<150μm). Its non-contact, low-thermal-impact "cold" processing characteristics minimize cutting stress, ensuring high cutting yield and electrical performance for high-value cells.
