Automatic Solar Cell Fiber Laser Scribing Machine
The Automatic Solar Cell Fiber Laser Scribing Machine is a core photovoltaic production equipment. It utilizes a high-precision fiber laser source to perform fully automatic, ultra-precise, high-speed, and near-damage-free cutting (scribing) on silicon-based solar cells. This enables the separation of cells into smaller pieces or the processing of specific shapes.
Product Features
High-Precision Fiber Laser: Employs a high-precision fiber laser to perform automated scribing/cutting operations on solar cells (primarily silicon-based), efficiently dividing whole cells into required sizes (e.g., half-cells).
Non-Contact Processing: Utilizes non-contact fiber laser processing, characterized by high precision, fast speed, minimal thermal damage (small Heat-Affected Zone - HAZ), and excellent edge chipping control. This significantly reduces cell damage and improves product yield rate.
Fine Processing Effect: Produces ultra-narrow, uniform kerfs with minimal chipping, maximizing the mechanical strength and electrical performance of the cells. This meets the requirements for subsequent high-precision processes like string soldering, making it a key process equipment for producing high-efficiency half-cell, shingled, and other advanced cell modules.
Enhanced Processing Efficiency: Significantly improves the processing efficiency and automation level of solar cell module production lines. It is a core production equipment in the photovoltaic manufacturing industry for boosting cell utilization and module power.
Technical Specifications
Model: YHC-30
Laser Type: 1064nm Fiber Laser
Beam Quality (M²): 1.3
Worktable Travel: 800×300mm
Max. Scribing Speed: 600mm/s
Scribing Accuracy: ≤0.02mm
Auto Positioning Accuracy: ≤±0.05mm
Cooling System: Air Cooling
Processing Range: 230×230mm
Compressed Air: 0.5~0.8MPa
Power Supply: 220V/50HZ
Equipment Dimensions: 2900×930×1740mm
Product Applications
Core Link in PV Cell Manufacturing: This equipment is a key device on crystalline silicon solar cell (monocrystalline/polycrystalline) production lines. It is specifically designed for precisely cutting complete square or quasi-square silicon wafers (cell precursors) into the required smaller cell units (typically half-cells or smaller sizes). This is a fundamental step in manufacturing high-efficiency solar cell modules.
High-Efficiency Cell Processing (Half-Cut, Multi-Busbar Technology): Widely applied in producing mainstream half-cut cells and future third-cut, multi-cut cells. Precise laser scribing effectively reduces cell current, lowers resistive losses and hot spot risk, thereby significantly enhancing module power output and reliability.
Wafer Processing & Module Encapsulation Stages: Beyond cutting cell precursors during cell manufacturing, some equipment is also applied in edge treatment/scribing after initial wafer cutting: Performing precise cutting or edge trimming on wafers cut from the initial silicon ingot. Cell scribing before module encapsulation: Scribing purchased standard whole cells before string soldering to meet the requirements of specific module designs (e.g., half-cut modules).
N-Type Cell Technology (TOPCon, HJT, IBC, etc.) & Thinner Wafer Applications: Particularly suitable for processing more efficient and thinner, more fragile N-type cells (e.g., TOPCon, HJT) as well as the industry's trend towards thinner wafers (e.g.,<150μm). Its non-contact, cold processing characteristics with minimal HAZ maximize the reduction of cutting stress, ensuring high cutting yield rates and electrical performance for high-value cells.
