Ultra-Large Size BIPV Module EL Defect Detector
The Ultra-Large Size BIPV Module EL Defect Detector is a high-precision automated equipment specifically designed to meet the special requirements of the Building Integrated Photovoltaics (BIPV) field. Utilizing advanced high-resolution Electroluminescence (EL) imaging technology, it performs full-coverage, non-contact scanning detection on ultra-long, ultra-wide (typically up to several meters in size), and potentially non-standard shaped BIPV modules under darkroom conditions. This system efficiently and accurately identifies various internal micro-defects such as micro-cracks, finger interruptions, black core cells, broken cells, sintering defects, Potential Induced Degradation (PID), poor contacts, and process flaws. It serves as a core and critical inspection equipment to ensure the outgoing quality of BIPV modules, enhancing power generation efficiency and long-term reliability.
Product Features
Ultra-Large Size & Strong Compatibility: Its core advantage lies in its ability to effortlessly handle challenges posed by BIPV modules that are oversized (length/width up to several meters, e.g., 3.5m x 2.3m or larger), overweight, and non-standard shaped (e.g., curved, irregular). It features a precision motion platform with ultra-long travel and high load-bearing capacity, along with customized fixtures/loading platforms. Compatible with mainstream and customized BIPV module sizes and structures, it adapts to various forms such as PV tiles, PV curtain walls, and PV skylights.
High-Resolution, High-Sensitivity EL Imaging: Employs high-resolution, high-quantum-efficiency near-infrared cameras paired with a high-power, extremely uniform current driving system, ensuring the capture of weak electroluminescence signals even on ultra-large modules. Optimizes optical paths and imaging algorithms to address potential low transmittance issues (colored/textured glass) in BIPV modules, improving the signal-to-noise ratio for clear subsurface imaging.
Full-Coverage, High-Precision Detection: Equipped with a precision multi-camera stitching system for stable, non-contact, full-coverage scanning of large-sized modules, ensuring no blind spots. High positioning accuracy guarantees precise defect location marking, meeting process traceability and repair requirements.
Advanced Darkroom Environment & Safety Design: Integrates an extra-large, highly sealed, low-stray-light darkroom to provide an absolute dark environment for EL detection, ensuring imaging quality. Incorporates safety protection measures such as high-voltage insulation, safety interlocks, emergency braking, and reliable grounding to safeguard personnel and equipment during the inspection of oversized modules (often under high voltage).
High Efficiency & Reliability: High automation significantly improves inspection efficiency, shortens cycle times, and meets the throughput demands of BIPV production lines or laboratories. The system is stable and reliable, with key components (e.g., cameras, light sources, motion parts) selected from high-quality industrial-grade products, ensuring long-term continuous stable operation and reduced maintenance costs. Non-contact detection avoids damage to fragile or special-surfaced (e.g., enameled glass) BIPV modules.
Technical Specifications
Model: YHEL-3523
Applicable Process: Defect detection for pre-lamination & post-lamination modules
Testing Type: Mono-crystalline, Poly-crystalline BIPV Modules
Camera Type: Professional Industrial Camera
Resolution: 60 Megapixels
Shooting Mode: Multi-Camera Mode
Sensitivity: Capable of detecting cracks with width less than 0.03mm
Effective Testing Area: 3500*2300mm
Stabilized Power Supply: 100V/30A
Image Acquisition Time: 1~60s (Adjustable)
Power Supply: 220V/50HZ
Equipment Dimensions: 3700×2560×1155mm
Applications
Quality Control in BIPV Module Manufacturing: Performs 100% full inspection of oversized, irregularly shaped (curved/triangular/trapezoidal), and colored-glass-based BIPV modules at the production line end station. Accurately identifies process defects like micro-cracks, finger interruptions, and broken cells to strictly control outgoing quality.
On-site Installation Acceptance for BIPV Projects: Deployed at construction sites to enable non-destructive incoming inspection of modules after transportation and concealed damage detection after installation. Quickly diagnoses internal micro-cracks caused by handling or construction stress.
R&D Validation of Customized BIPV Products: Specifically provides defect imaging support for innovative designs such as translucent concrete, flexible substrates, and hollow irregular modules. Overcomes the pain point where traditional equipment cannot detect non-standard structures, accelerating product iteration.
