Model:YHCT-PL

Technical parameters

1. Test object: Mono crystalline cell, poly crystalline cell, mono crystalline silicon wafer and poly crystalline silicon wafer;

2. Maximum size: 210mmx210mm;

3. Detection efficiency: single detection time is less than 0.5 seconds;

4. Types of identifiable defects: black center, black edge, black mass, hidden crack, crack, fragment, low efficiency piece, black line, missing angle and collapse Edge, etc;

5. Automatic defect identification without manual work;

6. It can be used for cell sorting and defect detection before or after welding;

7. The laser power is adjustable to adapt to various types of batteries;

8. All defect discrimination is parameterized, and users can realize individual judgment standard through parameter adjustment;

9. Network port communication is adopted, which can form its own equipment or be embedded into the production line for on-line detection;

10. It can realize the simultaneous detection of multiple small pieces;

11. The software interface is friendly and easy to operate.

System composition: laser light source, infrared camera, HD lens, filter and detection software. 

Feature

1. Non contact detection to avoid secondary damage;

2. Specific image acquisition system (without darkroom), high image quality;

3. High detection efficiency, can be embedded in the production line for on-line detection;

4. Adopt artificial intelligence algorithm to realize automatic defect identification without manual intervention;

It can be used for various types of silicon wafers or cells, and also for defect detection in various stages;